Embedded Computing Design

In this episode of Embedded Insiders, we're joined by Sriram Krishnan, BlackBerry's Head of Product Management, to discuss CylanceMDR, their AI-powered managed detection and response solution. We’ll explore how its XDR architecture enhances security by seamlessly integrating with existing tools, enabling more efficient threat detection and response.

In this episode of Embedded Insiders, we take a deep dive into the newly announced HBM4 Memory Controller IP from Rambus, with insights from Fellow and Distinguished Inventor Steven Woo. Rambus is leading the way with its silicon IP portfolio, and Steven shares his perspective on the latest memory industry trends, the challenges it faces, and the impact of AI on memory technologies.

On this episode of Embedded Insiders, we’re joined by Calista Redmond, CEO of RISC-V International, and Andrea Gallo, VP of Technology, as they dive into the organization’s latest technical breakthroughs, the evolving RISC-V software ecosystem, and how RISC-V is making an impact in the AI/ML sectors—and beyond.

On this episode of Embedded Insiders, Wayne Lyons, AMD’s Automotive Senior Director, provides an update on AMD’s automotive business, trends, and vision for the future. Wayne also dives into the company’s recent advancements in automotive processors like the Versal AI Edge Series, and their success with companies deploying their solution, like Subaru.

On this episode of Embedded Insiders, Jack Weast, Intel Fellow and Vice President and General Manager of Intel Automotive, breaks down the company’s recently announced OLEA U310 SoC. Built with a hybrid and heterogeneous architecture, the solution is designed to improve the overall efficiency of electric vehicles by promoting energy efficiency, and lower design and manufacturing costs.

On this episode of Embedded Insiders, we dive into the growing advancements in AI and HPC with Lou Ternullo, senior director of IP product marketing at Rambus. Lou highlights the evolving data center architectures and the increasing demands for high bandwidth, low latency, and robust performance. He also explains how Rambus is staying ahead of the curve with its recently launched PCI Express® (PCIe®) 7.0 IP portfolio. 

On this episode of Embedded Insiders, Rich and Erik Wood, Senior Director of Product Security at Infineon Technologies, discuss security at the edge. Diving into the company’s wide variety of secure features, Infineon’s newest MCU line, the PSoC Edge, is a single solution highlighted for its "MCU-ness” and effort in making edge security simpler and cheaper. 

On this episode of Embedded Insiders, Senior Technology Editor, Ken, and Errol Leon, System Engineering & Marketing Manager of Robotics at Texas Instruments (TI) discuss the work of robotics in collaboration with humans and the role of motor control, board-to-board communication and sensor fusion in the future of robotics.

But first, Rich and Ken recap a recent trip to Taipei for COMPUTEX 2024.

On this episode of Embedded Insiders, Rich and Vin are taking over with a Dev Talk featuring Matt Johnson, the CEO of Silicon Labs. Continuing their “CEO takeover,” the two are deep-diving into Matt’s background, journey with the semiconductor manufacturing company, and his opinion on how  AI will affect incoming engineers. 

But first, Rich and Ken are calling out Intel. If you didn’t know, Intel acquired Altera in 2015, however, we've still got some questions about the company’s expansion and presence in the FPGA market.

On this episode of Embedded Insiders, Alexander Kain, Skyworks Solutions’ Senior Principal Artificial Intelligence Systems Engineer joins the podcast to discuss his company’s advanced AI noise suppression, designed to reduce noise in a variety of environments and applications. 

On this episode of Embedded Insiders, we’re discussing the evolution of processor cores, multitasking capabilities, future trends involving processor design, and more with Aaron Frank, senior product manager at Curtiss-Wright Defense Solutions. 

On this episode of Embedded Insiders, we’re featuring a group of AI experts all hailing from vendors based in Taiwan. The vendors, certainly leaders in their own right, are DFI, ASUS IoT, and Shuttle, and they all feature IoT products, or in this case, AIoT products. The event was organized by the International Trade Association (TITA). Give it a listen.

On this episode of Embedded Insiders, Rich is joined by Tobin Richardson, president and CEO of the Connectivity Standards Alliance (CSA), and Steve Hanna, distinguished engineer at Infineon Technologies, to discuss the CSA's recently launched IoT Device Specification 1.0, a one-stop solution for device certification for manufacturers.

On this episode of Embedded Insiders, we’re defining the architectural differences between MCUs and DSCs with Microchip Technology’s Product Marketing Manager, Pramit Nandy. We also dive into the different processing capabilities, the challenges for designers, and what we can expect as far as emerging trends and technical developments from Microchip.

On this episode of Embedded Insiders, we’re discussing why multi-camera synchronization is a key feature in cameras that enable industrial robotics, retail application, autonomous mobility, and more, with Mr. Maharajan Veerabahu, co-founder & vice president of product design services at e-con Systems.

On this episode of Embedded Insiders, Tomide Adesanmi, Co-Founder and CEO of Circuit Mind, dives into his company’s deterministic AI platform that’s designed to help circuit designers quickly take their design process from architecture into schematics. 

Check out Circuit Mind’s public launch webinar here: https://www.bigmarker.com/eetech-media/Circuit-Mind-Live-Launch-The-World-s-First-Deterministic-AI-for-Professional-Electronic-Engineers?utm_bmcr_source=cm-other

On this episode of Embedded Insiders, Meghali Chopra, CEO at SandBox Semiconductor, gives insight into her company’s AI-enabled modeling platform that accelerates the development of semiconductor manufacturing processes. 

On this episode of Embedded Insiders, Artem Aginisky, product line manager of arm-based processors at Texas Instruments, dives into the topic of edge AI, specifically, how he defines edge AI and how TI is working on democratizing edge AI through innovations in microprocessors and software.

On this episode of Embedded Insiders, Paul Fischer, senior principal engineer in the Components Research Department at Intel, discusses the trends and challenges surrounding transistor scaling and backside power. So, ICYMI, these were some of the the top technical research breakthroughs Intel presented this year at IEDM. 

On this episode of Embedded Insiders, EVP and Brand Director, Rich Nass, sits down with Stephen Huang, ADLINK Technology President & COO to discuss the company’s upcoming ideas and innovations.