Edge AI
ScioSense Launches UFC23 Ultrasonic Flow Converter for Smart Water, Heat, and Gas Meters
May 15, 2026
Eindhoven, The Netherlands. ScioSense released its UFC23, a 4th generation ultrasonic flow converter for measurement in water, heat, and gas meters. The solution is designed for meter manufacturers requiring high measurement accuracy and low power consumption, while sustaining flow calculation on a central microcontroller.
Edge AI
Darveen to Showcase Edge AI and Rugged Industrial Systems at COMPUTEX 2026 and Automate 2026
May 15, 2026
Darveen announced it will attend both COMPUTEX 2026 in Taipei (June 2-5, Booth P0814, Hall 2, Taipei Nangang Exhibition Center) and Automate 2026 in Chicago (June 22-25, Booth 4172, McCormick Place South Building). During the exhibitions, Darveen will demonstrate its "Taiwan Heart, Global Reach" initiative while displaying its commitment to the global markets.
Multimedia
ICYMI Ep 62: Arm, Qualcomm, NVIDIA, Siemens, Synopsys
May 15, 2026
Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
AI & Machine Learning
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Arduino: Portenta H7
May 12, 2026
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STMicroelectronics: STM32U3B5
May 12, 2026
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Arm: Cortex-M0+
May 12, 2026
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Semidynamics and SiPearl Partner on European Rack-Scale AI Compute Platform
May 12, 2026
Automotive
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AutoSens and InCabin will return to Huntington Place, Detroit | 9-11th June 2026
May 11, 2026
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embedded world 2026 Podcast with NXP
May 06, 2026
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New Eagle Releases OpenECU NX3 to Simplify EV Architectures with Unified Charging and Control
May 05, 2026
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POLYN Technology Announces Tapeout of Automotive Chip
April 29, 2026
Industrial
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embedded world North America Announces Two Industry-Leading Keynote Speakers
May 12, 2026
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DigiKey Adds Thousands of New Products for AI and IoT
May 04, 2026
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Avalue Unveils EPC-TWL Industrial Fanless PC with Intel Twin Lake Processor and Dual 4K Display Support for Edge AI
April 21, 2026
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Microelectronics US 2026: VisAbility Solutions SmartSeeker Boosts Semiconductor Productivity with Intelligent Asset Visibility
April 20, 2026
Networking & 5G
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HighPoint Technologies Introduces Rocket 1604L Retimer-Based PCIe M.2 Add-In-Card for High-Speed AI Environments
April 21, 2026
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7STARLAKE Releases THOR11-H6/X6 1U Servers with Intel Xeon D for AI and Defense Edge
April 06, 2026
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Digi International Launches Digi IX25: Rugged 5G Router for Industrial IoT and Critical Infrastructure
April 06, 2026
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Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF
March 04, 2026
Open Source
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Mouser Product of the Week: NXP Semiconductors’ FRDM-A-S32K312 Evaluation Board
May 11, 2026
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Arteris Partners with MIPS to Accelerate Physical AI SoC Development with RISC-V Platforms
April 23, 2026
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Dev Kit Weekly: STM32MP257F Dev Kit from Newark, an Avnet company
April 22, 2026
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Innatera Unveils Synfire: Community-Driven Platform Tackling Neuromorphic Ecosystem Fragmentation
April 08, 2026
Security
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embedded world 2026 Podcast with PQ Shield
May 04, 2026
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Using Safety Application Notes to Aid Safety Designs Part 2: Plugging in the FMEDA
April 28, 2026
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Digi DAL OS Solutions Gain FIPS 140-3 Validation for Government and Regulated Industries
April 16, 2026
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Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity
April 10, 2026
Software & OS
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Tool integration provides AI with the guardrails needed for embedded code generation
May 14, 2026
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Ada Is a Memory-Safe Language. It's Also Not New. That's the Point.
May 04, 2026
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embedded world 2026 Podcast with Texas Instruments
April 30, 2026
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MathWorks Brings Trusted AI to Embedded Systems Development in MATLAB and Simulink Release 2026a
April 30, 2026
HPC/Datacenters
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Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon
March 25, 2026
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PSM Integration for Enhanced Module Solutions in 48 V Data Centers
March 04, 2026
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BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation
March 04, 2026
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Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures
March 03, 2026