COM Express Type 6 and COM-HPC Client: Two great options

Christian Eder

September 24, 2020

Product of the Week: Lattice Semiconductor's Single-Wire Aggregation IP

Embedded Computing Design Staff

September 14, 2020

FIWARE Foundation Announces New FIWARE Accelerator Initiative Partners

Perry Cohen

August 17, 2020

Tempo Automation Welcomes Jeff Kowalski to Board of Directors

Tempo Automation

July 23, 2020

CHIPS Alliance Announces AIB 2.0 Draft Specification

Perry Cohen

July 17, 2020

High-Performance Multimedia Single Board Computer with NXP i.MX 8M CPU from F&S Elektronik

Tiera Oliver

July 9, 2020

congatec SMARC 2.1 Carrier Board Makes Intel Atom Processor Based 3.5-inch SBCs Modular

Tiera Oliver

May 28, 2020

Embedded Executives: Eduardo Quinones, Senior Researcher, Barcelona Supercomputing Center

May 27, 2020

Khronos and Smithsonian Collaborate to Diffuse Knowledge for Education, Research, and Creative Use

The Khronos Group

Smithsonian

March 5, 2020

The Zephyr Project Welcomes Adafruit Industries to its Open Source Ecosystem

The Zephyr? Project

The Linux Foundation

Adafruit

February 27, 2020

Rohde & Schwarz and Decawave Develop T&M Capabilities for Ultra Wideband Technologies

Tiera Oliver

February 24, 2020

MicroMax Announced That It Will Exhibit Its New Line of Rugged Computer Systems at Embedded World 2020, February 25th to 27th in Nuremberg,

MicroMax

February 23, 2020

Advancements In Card Lok Technology to Satisfy SWaP and Second Level Maintenance Requirements

nVent SCHROFF

February 19, 2020

Active Silicon Announces Faster Interface Boards in its Expanded FireBird Range

Tiera Oliver

February 11, 2020

COM-HPC Rings in Good Tidings for the World of Edge Server Designs

Christian Eder

February 10, 2020

Infineon Technologies AG Results for the First Quarter of the 2020 Fiscal Year

Infineon

February 6, 2020

Open Standards for Accelerating Embedded Vision and Inferencing: An Industry Overview

Neil Trevett

January 23, 2020

Bressner to Present Hardware for Trend Topics at Embedded World 2020

Bressner

January 21, 2020

BRESSNER Technology at embedded world 2020 in Nuremberg. Booth number: 1-341.

Why an Open Standards Approach Is Essential in Defense and Aerospace

Embedded Computing Design

January 7, 2020

Concurrent Releases High-Performance AdvancedMC Processor Board

Alix Paultre

December 19, 2019

OpenVX 1.3 Adds Feature Sets for Optimized AI & Vision Processing

Brandon Lewis

October 22, 2019

SmartDV to Exhibit at OpenPower Summit August 19-20

SmartDV? Technologies

August 28, 2019

Khronos Releases New NNEF Convertors, Extensions, and Model Zoo

Khronos

August 28, 2019

Avnet Introduces Ultra96-V2 Development Board

Avnet, Inc.

March 27, 2019