Embedded Computing Design

Visitors to Hall 3, Booth 257 at embedded world will witness the ASUS IoT RUC-1000G, an innovative edge AI computing platform designed for seamless AI deployment, system integration, and high-performance GPU utilization. The solution is powered by Intel’s Core Ultra S-series processors with W880 chipset, PCIe 5.0 support, and a modular half-rack design for scalable AI applications.

SAPPHIRE Technology is introducing the SAPPHIRE EDGE+ VPR-5050 Series and products from its EDGE AI SERIES during embedded world. Hall 5, Booth 322 will demonstrate the EDGE + MB series featuring the EDGE+ VPR-5050-MB and EDGE+ VPR-5050A-MB Mini-ITX motherboards, ideal for AI acceleration, industrial automation, and edge computing. The solutions leverage AMD Embedded+ architecture with integrated AMD Ryzen Embedded V2748 processors with AMD Versal AI Edge adaptive SoCs.

congatec, an Intel Titanium partner, will be exhibiting its new Computer-on-Modules at embedded world (Hall 3, Booth 241) leveraging the latest Intel technologies from the credit card sized conga-SA8 SMARC module built with low-power Intel Core 3 technology to the high-performing conga-HPC/cBLS COM-HPC Client module utilizing intel Core S processor technology.

Austin, Texas. Earlier, Emerson released new additions to its data acquisition (DAQ) lineup, including the NI cDAQ-9187 and cDAQ-9183 Ethernet chassis and NI 9204 input module. Access to a GitHub repository for NI FlexLogger DAQ software plug-ins is available leading to lower costs for operating high-performance test and measurement systems over Ethernet.

Stutensee, Germany. Tria Technologies, an Avnet company, will launch five innovative families utilizing Qualcomm’s Dragonwing and Snapdragon platforms at embedded world. The solutions deliver powerful computing and efficiency for the next generation of IoT devices. The enhanced AI performance opens innovation for AI deployment at the edge.

AAEON, a Titanium member of the Intel IoT Solutions Alliance, will be in Hall 1, Booth 306 at embedded world highlighting its edge AI hardware platforms. Its collaboration with Intel aims to bring innovative products to market and implement edge AI solutions through bilateral initiatives, shared practices, and joint goals.

At embedded world 2025, Advantech will be in Hall 3, Booth 339 showcasing its series of Edge Computing and Edge AI solutions leveraging Intel’s innovations including Bartlett Lake S, Arrow Lake, Twin Lake, Sapphire Rapids-W, and Battlemage. Demonstrations will include AI-powered defect detection, edge AI Server, and embedded boards.

Supermicro will demonstrate its latest lineup of infrastructure solutions supporting edge AI and IoT applications. Visit Hall 1, Booth 208 at this year’s embedded world with highlights including Supermicro's SYS-E403-14B, 3U SYS-322GA-NR system, and a range of compact and fanless platforms.

embedded world will host AntennaWare at Booth 3-109 where it will highlight its BodyWave antennas. AntennaWare will demonstrate the improved connectivity of BodyWave antennas for wearables, effectively addressing detuning and body blocking issues that interfere with signals, even in non-line-of-sight (NLoS) scenarios.

While attending embedded world, stop by Booth 4-738 where MICROIP will showcase its innovations in ASIC design integration and AI software services. Demonstrations will include solutions engineered for the increasing demand of high-performance, low-power semiconductor technologies.

Vecow will showcase its latest AI-accelerated solutions for edge computing, mobile robots, spatial AI, thermal solution, and Generative AI at this year’s embedded world (Hall 3, Booth 449).

Sealevel team members will be on hand at embedded world 25 (Hall 3, Stand 555) where they will showcase solutions for test and measurement, manufacturing automation, complete system control, and military and aerospace. Another main attraction will be the international introduction of Sealevel’s newest addition to its Relio industrial computer line, the R1 Edge.

ADLINK Technology Inc. will showcase its latest advancements in Hall 3, Booth 147 at embedded world 2025 where its motto will be "Greener Tech, Smarter Edge AI" promoting the company’s dedication to sustainability, intelligent Edge, AI, and Smart Manufacturing. ADLINK will highlight its solutions designed to reduce energy consumption and optimize operational efficiency.

Smiths Interconnect will be located at Hall 4a Booth 606 during this year’s embedded world, where it will showcase its SpaceABLE^® 10G SL Series and 28G SL Series radiation-resistant onboard embedded optical transceiver modules delivering radiation hardness, robustness, longevity, and high I/O density.

axem announced its collaboration with Techstars, delivering solutions to grow and automate development environments that enable time savings including build and test processes. By taking part in Techstars, an elite startup accelerator, axem will receive expert mentorship, critical resources, and international connections to fast-track its platform’s progress.

BIWIN Storage Technology Co., Ltd. (BIWIN) will exhibit its innovative Mini SSD at embedded world 2025 located at Booth 1-140. Attendees will experience firsthand how BIWIN is pushing the boundaries of storage technology with the Mini SSD leading the way.  It delivers high-performance and compact solutions for mobile devices, edge computing, and beyond.

Visit Booth 4A-324 at this year’s embedded world to witness Samtec’s COM-HPC connectors and see how they are constructed for evolving standards Built on Samtec’s AcceleRate HP High-Performance Arrays, COM-HPC Server and Client modules integrate two 400-pin connectors, providing 800 pins in total with the COM-HPC Mini module omitting one of these connectors.

At this year’s embedded world, BIWIN (Booth 1-140) will showcase its range of solutions and specifically highlight two standout products to that showcase BIWIN’s abilities in addressing various embedded storage markets.

Apacer will showcase its innovative industrial storage solutions at Embedded World 2025 in Hall 1, Booth 310, featuring optimized computing, energy efficiency, and sustainable technology. Be sure to attend Dr. Gibson Chen’s talk, "Advanced Storage for Industry Transformation," on Tuesday, March 11, at 10:30 AM in Hall 3, where he will share insights into the future of industrial storage technology.

Avnet Silica will present its Phone Box at this year’s embedded world. Stop by Booth 3A-111 to witness a merge of classic charm with next-gen AI. The demonstration’s highlight is an edge-based generative AI integrated in a vintage telephone booth. With TRIA and AMD solutions, it enables real-time AI interactions running entirely on edge hardware.