Embedded Computing Design

During COMPUTEX 2026, Aetina Corporation will demonstrate its latest innovations in edge AI solutions in Hall 1, Booth K0106. The booth will highlight Aetina’s portfolio including SuperEdge, MegaEdge, DeviceEdge and CoreEdge along with real-time interactive demonstrations co-developed with strategic partners and ecosystem innovators. The exhibition will show how edge AI is progressing from single inference models into integrated applications with contextual intelligence across Physical AI, Vision AI, and Agentic AI.

At the Global Space Technology Forum in Singapore, Enclustra demonstrated how reconfigurable hardware is shaping the future of space communication. At the show, Enclustra collaborated with Array Labs, Transcelestial, and Makarena Labs to demonstrate how advances in space technology will occur from the merging of reconfigurable hardware, artificial intelligence, and domain expertise.

NEXCOM will be a prominent force at COMPUTEX 2026 where it will be partnering with Intel in TWTC Hall 1, Booth A0618 at the "Robotics & Edge AI Pavilion". The booth theme will be "Physical AI and Manufacturing On-Site," where NEXCOM will show how Physical AI is accomplished by integrating visual perception and high-precision real-time motion control.

Visitors to COMPUTEX 2026 (Taipei Nangang Exhibition Center) will want to visit Booth R1014, Hall 2, 4F where Seasonic is set to introduce its new flagship power platform for AI, PRIME ENTERPRISE. Attendees will also witness Seasonic’s innovative ultra-efficient power development inspired by emerging 80 PLUS Ruby standards and the latest evolution of OptiGuard intelligent protection technology.  

Kardome’s Spatial Hearing AI for human-like voice localization and isolation is now being integrated into LG’s OLED TVs. The technology allows the TVs to locate and focus on individual speech with human-like accuracy, even when background noise is high.

Arteris, Inc.’s system IP technology is now being deployed by Li Auto Inc. The technology supports the underlying AI compute data movement and integration automation for Li Auto’s current and future smart vehicles, starting with its proprietary SoCs used in the all-new L9 Livis high-tech SUV.

Sundance DSP introduced the FG650-Polarfire, a variant of the company’s proven FG650 Four‑Channel Camera Link Frame Grabber that is executed on the Microchip PolarFire FPGA family. It is fully compatible with Sundance DSP’s Polarfire SOMs and carrier boards, allowing designers the ability to integrate high‑bandwidth imaging pipelines directly into heterogeneous compute systems combining FPGA acceleration, embedded processors, and edge‑AI capabilities.

Avalue Technology released its HPS-GNRU1A 1U rackmount server platform and the HPM-GNRUP industrial server board, merging the Intel Xeon 6 platform, PCIe Gen5 architecture, and high-density NVMe storage to offer customizable solutions for centralized data centers. The solution delivers up to 350W TDP and integrates PCIe Gen5 architecture with dual 10GbE LAN interfaces to meet the demands of high-speed data transfer and low-latency computing demands.

Axiomtek launched the compact (100 x 72 mm) PICO570, its recent Pico-ITX single board computer leveraging Intel Core Ultra processors (Series 1) for AI applications at the edge and an integrated NPU offering up to 11 TOPS.

Variscite, an NXP Semiconductors Platinum Partner, will release the SMARC-compatible VAR-SMARC-MX95 SoM built on NXP's i.MX 95 processor offering a scalable foundation for industrial IoT and edge AI applications. The solution is powered by up to six Arm Cortex-A55 cores running up to 2.0 GHz and accompanied by dedicated Cortex-M7 and Cortex-M33 real-time co-processors for deterministic control tasks.

GÖPEL electronic announced its Multibus Controller 6281 automotive Ethernet expansion for faster, parallel communication testing. Up to eight 10BASE-T1S transceivers expand the 62 Series for ECU testing via PCI Express, PXI Express, and stand-alone modes. The solution delivers the requirements and transmission standards of the automotive market.

BrainChip Inc. introduced an expansion of its software partner ecosystem with MulticoreWare, P-Product, and BeEmotion.ai aiding BrainChip in designing innovative machine learning models specific to the new Akida AKD1500 processor.

Synaptics Incorporated will exhibit at COMPUTEX Taipei 2026 taking place June 2–5, at the Taipei Nangang Exhibition Center. The company will highlight how its AI-native compute, connectivity, and sensing solutions are innovating the next generation of Edge IoT applications.

Eindhoven, The Netherlands. ScioSense released its UFC23, a 4th generation ultrasonic flow converter for measurement in water, heat, and gas meters. The solution is designed for meter manufacturers requiring high measurement accuracy and low power consumption, while sustaining flow calculation on a central microcontroller.

Darveen announced it will attend both COMPUTEX 2026 in Taipei (June 2-5, Booth P0814, Hall 2, Taipei Nangang Exhibition Center) and Automate 2026 in Chicago (June 22-25, Booth 4172, McCormick Place South Building). During the exhibitions, Darveen will demonstrate its "Taiwan Heart, Global Reach" initiative while displaying its commitment to the global markets.

Lund, Sweden. Qoitech announced the release of its Otii Software 3.7 that introduces the Battery Life Estimator, a measurement-based battery runtime prediction tool integrated into the Otii power measurement workflow.

Synopsys announced that after independent evaluation by SGS TÜV Saar, the company has become the first to achieve product certification for ISO/PAS 8800, outlining the safety requirements for the use of AI in road vehicles. Due to the number of sensors in on-road vehicles utilizing AI, data delay is critical and secure, real-time communication is now a must for automotive safety. ISO/PAS 8800 focuses on verified product behavior, not just development processes.

Axiomtek introduced its ultra-compact (4.8 x 11 x 15 cm) and rugged DIN-rail industrial IoT gateway, the ICO150, engineered for collecting data and environmental monitoring at the industrial edge. The solution is powered by the quad-core Intel Atom x7433RE processor and is designed to support distributed deployments across factories, agriculture, and smart building environments.

Morse Micro released information it is welcoming a new distribution partnership with DigiKey. Customers now have global access to Morse Micro’s Wi-Fi HaLow products that streamline the evaluation, prototyping, and building of innovative long-range, low-power wireless devices including its MM8108 products.

Barcelona, Spain and Maisons‑Laffitte, France. Semidynamics and SiPearl are partnering to develop a European rack‑scale AI compute platform dedicated to large‑scale AI inference in the cloud. The companies offer a common goal of delivering an autonomous high‑performance energy‑efficient compute solution supporting European initiatives, both public and private, including AI Factory and Giga Factory applications.