Embedded Computing Design

Advantech will attend NVIDIA GTC 2026 from March 16–19 in San Jose, California. The company will be in Booth #1134 and Meeting Rooms #6077 and #6078 where it will highlight and discuss its edge AI innovations powered by NVIDIA Jetson Thor and NVIDIA IGX Thor. Exhibit features will include how physical AI and edge AI are supporting real-world deployments across robotics, medical systems, smart logistics, and intelligent retail environments.

Axiomtek introduced its DSP522, a 40 mm slim fanless digital signage player leveraging the 13th Gen Intel Core i5‑1335UE or Intel Processor U300E. The platform supports up to four independent 4K UHD displays via HDMI 2.1 (TMDS) providing enhanced visual performance, energy efficiency, and dependability. The onboard MCU facilitates Fixed EDID to uphold stable resolution, even when used with matrix switches or during system reboots. A cable-lock design prevents accidental disconnections.

Sfera Labs announced the new M.2 LTE Module X2-Series Expansion Board (X2BW10XM2Z), a swappable expansion board that adds always-on LTE cellular connectivity and GNSS positioning to its Strato Pi Max XL and XS servers. It is ideal for deployments where connections to wired Ethernet or Wi-Fi are not desirable.  

Hilscher announced two new PC cards for secure industrial communication based on the netX 90 system-on-chip (SoC). The cifX PCIE90-RE and the cifX LPCIE90-RE are available in PCI Express and low-profile PCI Express form factors.

TASKING attended embedded world Germany where it showcased solutions that connect the full embedded software lifecycle from compile to debug and test through one integrated workflow ideal for automotive, aerospace and defense, industrial, and robotics applications.

APLEX Technology Inc. thanks everyone who visited and supported it during embedded world Germany. During the show APLEX demonstrated its new ATEX explosion-proof solutions, including panel PCs, displays, and AVoIP (Audio and Video Over Internet Protocol) box.

BeagleBoard.org announced its BeagleBadge, a limitless innovation platform that brings a new vision to wearables and low-power computing. BeagleBadge follows the company’s central values of access, literacy, ownership, and longevity, ensuring users the tools needed to create. It delivers rapid prototyping, research, and real-world solutions in health, environmental monitoring, and human-machine interfaces.

Join Ambarella at Hall 5, Booth 5-355 during embedded world Germany where it will exhibit its AI SoCs, software stack, and developer tools that help teams build, integrate, and deploy edge AI solutions at scale. The booth is centered on the theme “The Ambarella Edge: From Agentic to Physical AI” and will have live demos highlighting innovations that offer a competitive advantage across various AI applications, from agentic automation and orchestration to physical AI systems operating in real-world environments.

Innatera will be in Hall 3A, Booth 3A-430 at embedded world Germany, exhibiting its expanding portfolio of neuromorphic deployments developed with partners and customers. The booth focus is not just on how to implement architecture, but how brain-inspired computing is applied across sensing, industrial monitoring, and intelligent devices.  

At embedded world Germany, Solectrix Medical (Hall 4A, Booth 152) will exhibit an Open Standard Module (OSM) in the Size-M format based on the NXP i.MX 95 applications processor. The module was designed for a leader in the medical industry as part of its system strategy for diagnostic devices.

Sundance will attend embedded world Germany where it will be located at the OpenSystems Media stand, Hall 1, Booth 500, showcasing its innovative SMT135-C. During the event, Chris Bowers, Sundance’s FPGA specialist, will lead an in-depth technical session on the SMT135-C where he will discuss the module’s highlights, performance capabilities, and suitable deployments. Engineers and developers will gain valuable insights into cutting-edge FPGA applications.

Throughout embedded world Germany (March 10–12, Nuremberg), SECO will be in Hall 1 at Booth 320 where it will focus on its NXP Semiconductors-based solutions. The spotlight will be on SECO’s portfolio built on NXP applications processors, with an emphasis on the i.MX 95 Applications Processors Family.

Rambus Inc. announced its HBM4E Memory Controller IP capable of facilitating innovative HBM memory deployments for next-generation AI accelerators, graphics, and HPC applications. It operates at up to 16 Gigabits per second (Gbps) per pin delivering a throughput of 4.1 Terabytes per second (TB/s) to each memory device. For an AI accelerator with eight attached HBM4E devices, this translates to over 32 TB/s of memory bandwidth for demanding AI workloads.

WITTENSTEIN high integrity systems (WHIS) will attend embedded world Germany where it will be in Hall 4, Booth 337 highlighting its RTOS solutions with proven evidence, global trust, certification leadership, and technology engineered from the ground up for safety critical embedded systems. WHIS offers fully pre-certified, standards compliant solutions purpose-built for safety-critical industries.

Altera will be in Hall 5, Booth 5-329 at embedded world Germany where it is planning to highlight how its Agilex FPGAs are engineered to meet the real-time demands of physical AI systems. Altera’s adaptable FPGA platforms deliver scalable acceleration from multi-sensor ingestion and AI inference to real-time control. Booth demonstrations will show how FPGAs power multi-sensor processing, AI-driven perception, and low-latency decision-making at the edge.

Akasa introduced the AK-CC7409BP01, a low-profile CPU cooler designed for thermally demanding, space-constrained environments. It is compatible with Intel LGA1851 and LGA1700 sockets and has an integrated copper vapor chamber heatsink and a UL-certified side blower fan delivering consistent cooling at 29.5mm in height. It is suited for 1U servers, SFF systems, and other applications where vertical clearance is limited.

TASKING will be highlighting its upgraded compiler at embedded world in Nuremberg March 10-12 (Booth 4-150, Hall 4). It supports the Renesas RH850/U2x microcontroller (MCU) family, including the new RH850/U2C series.

During embedded world Germany (March 10–12, Nuremberg), Infineon Technologies will showcase its latest PSOC microcontrollers, tools, and DEEPCRAFT AI Suite. Stop by Hall 4A, Booth 138 to explore new solutions across many applications and learn ways to accelerate your time-to-market on designs and AI/ML models.  

APLEX Technology Inc. will be in Booth 3-533 at embedded world Germany exhibiting its innovations designed for harsh environments in industries such as oil and gas, food and beverage, maritime, and more. APLEX provides factory automation and food and beverage automation solutions.

Menlo Microsystems Inc. (Menlo Micro) publicized that its collaboration with Purdue University has resulted in a commercial-ready architecture for quantum control and readout electronics at cryogenic temperatures. As published in the Nature Microsystems & Nanoengineering journal, the work explains Menlo Micro’s cryogenic MEMS Ideal Switch platform in scalable quantum computing applications.