Embedded Computing Design

Akasa released a 10 Gigabit PCIe Network Interface Card (NIC) engineered to modernize desktops, workstations, servers, and embedded systems to multi-gigabit Ethernet connectivity. The solution leverages the Realtek RTL8127AT chipset and features a PCIe 3.0 x2 interface. It supports six auto-negotiating speed tiers from 10Gbps, 5Gbps, 2.5Gbps, 1Gbps, 100Mbps to 10Mbps, while fitting PCIe x4, x8 and x16 slots.

MIPS, collaborating with Arteris, Inc, has optioned Arteris FlexGen smart NoC IP and Magillem SoC integration automation software for scalable SoC platforms for physical AI in applications including automotive microcontroller units (MCUs), advanced driver assistance systems (ADAS), robotics, and embedded computing. MIPS will integrate Arteris system IP to enhance development of optimized SoCs built on MIPS RISC-V processors.

Rambus introduced a SOCAMM2 (Small Outline Compression Attached Memory Module) chipset engineered for low-power, high-performance LPDDR5X-based memory modules for AI servers. The new SKUs enhance Rambus’s offering of complete memory interface chipsets for all JEDEC-standard DDR5 and LPDDR5 memory modules.

IndySoft announced its mobile calibration app, IndySoft Scales, that is touch-optimized, voice-enabled, and offline-first. The platform handles such industry challenges as delayed data from the field, inconsistent documentation quality, manual tolerance calculations, and paper-based workflows. It is designed to provide technicians with an easier platform than a traditional laptop offers in the field.

Teradyne, Inc. has acquired TestInsight with a goal of accelerating the development of test solutions on Teradyne platforms. The acquisition enhances Teradyne’s capability of supporting customer design-in activities and accelerates time to market for AI and data centers.

Avalue Technology Inc. released its Intel Twin Lake processor powered EPC-TWL fanless embedded platform offering consistent and flexible computing for industrial automation, smart retail, edge AI, and embedded applications. The EPC-TWL supports the Intel Processor N150 and N250 (optional), as well as the Intel Core 3 N355 (optional).

HighPoint Technologies, Inc. introduced the compact (167mm in length) Rocket 1604L, the company’s first Retimer-based PCIe M.2 Add-In-Card (AIC). The 4-M.2 PCIe Gen5 x16 solution leverages Astera Labs’ Gen5 Retimer technology and is purpose-built to meet the challenges of signal integrity demands of innovative AI and high-velocity compute environments.

VisAbility Solutions released its SmartSeeker that delivers intelligent, hands-free capabilities to the SmartMarker platform. During Microelectronics US 2026 (April 22–23), VisAbility Solutions will be located at Booth 137 showcasing a live demonstration. The company offers semiconductor, logistics, and manufacturing industries accurate, real-time visibility of high-value assets.

Being held on June 10^th and 11^th, Hardware Pioneers Max 2026 will be at Excel London with attendees including 6,000 engineers and technology leaders and more than 250 global exhibitors.

Tria Technologies launched the COM-HPC Client Computer-on-Module (CoM) leveraging the Intel Core Ultra Processors (Series 3). The module features an integrated AI accelerator (NPU) as well as Intel Xe graphics with up to 12 Xe cores, promoting up to 180 trillion operations per second (TOPS).

Digi International publicized an advancement in device security with the validation of FIPS 140-3 cryptographic modules across its portfolio of solutions based on the Digi Accelerated Linux (DAL) operating system including Digi EX, IX and TX Cellular Routers, Digi Connect IT Console Servers, Digi Connect EZ Serial Device and Terminal Servers, and Digi AnywhereUSB USB Over IP. According to the press release, Digi is the first provider of cellular connectivity solutions to achieve FIPS 140-3 validation without specialized SKUs.

AAEON introduced its CEXD-INTRBL, an open robotics development system powered by an Intel Core Ultra X7 Processor 358H CPU, an integrated Intel Arc B390 GPU, and NPU 5.0. The solution delivers up to 180 TOPS of AI performance. It is ideal for humanoid robotics and autonomous vehicle platform building.

Transcend Information, Inc. (Transcend) has expanded its embedded camera module portfolio, now supporting GMSL2, MIPI CSI-2, and USB interfaces. The expansion will enable designers to accelerate the deployment of AI vision capabilities across diverse AIoT applications, including smart manufacturing, smart transportation, robotics, smart healthcare, smart retail, and surveillance.

Microelectronics US 2026 will begin April 22 at the Palmer Events Center in Austin, Texas. The free to attend exhibition will run for two days and will feature more than 100 speakers from across the microelectronics supply chain. Attendees will have a chance to witness technical sessions and panel discussions with opportunities for direct access to solution providers.

Rapidus Corporation announced the opening of an Analysis Center and its Rapidus Chiplet Solutions (RCS). The center is nearby Rapidus’ Innovative Integration for Manufacturing (IIM-1) semiconductor foundry in Chitose, Hokkaido. The facility conducts the physical analysis, environmental and chemical analysis, electrical characterization, and reliability testing required for the design of next-generation logic semiconductors.

eInfochips introduced the EIC PROPEL, its enterprise IoT platform in the Microsoft Marketplace. The new availability enables users to deploy EIC PROPEL through the Microsoft Marketplace for streamlined access, seamless integration, and simplified lifecycle management across Microsoft Azure products and services.

Upon the safe return of four astronauts, Aptiv commended NASA on its successful Artemis II lunar mission. Aptiv was involved in the mission with its VxWorks delivering the software platform that enabled deterministic performance for critical functions on the Space Launch System’s (SLS) first stage of launch and within the Orion crew vehicle.

Siemens, in collaboration with NVIDIA, publicized that its Veloce proFPGA CS hardware-assisted verification and validation system is enabling the efficient creation of enhanced designs by running and capturing trillions of verification cycles, prior to first silicon availability.

Microchip Technology released information that it is now certified by UL Solutions to the IEC 62443‑4‑1 Maturity Level 2 (ML2) Industrial Automation and Control System standard. The achievement highlights the fact that Microchip’s product development process meets globally recognized secure by design criteria.

While attending Touch Taiwan 2026, Nanomade exhibited new sensor technology that converts metal, glass, plastic, and other everyday surfaces into interactive force and touch interfaces. Nanomade ran live demos on laptops, wearables, headphones, and consumer electronics, including metal coats.