CHANDLER, Arizona —  Microchip Technology announced new industrial-grade single pair ethernet (SPE) products. The 10BASE-T1S MAC-PHYs are designed to connect edge IIoT devices to the cloud, and industrial versions of its 100BASE-T1 Time Sensitive Networking (TSN) Ethernet PHY transceivers and switches are designed for high-speed applications across wide Ethernet networks.

A must see at embedded world 2023 is our friends and neighbors at Microchip. Visit hall 3 booth 443 to explore its latest demos under the themes of sustainability, security, and functional safety.

Microchip’s new LAN8650 and LAN8651 10BASE-T1S MAC-PHY Ethernet Controllers with SPI Interface simplify the implementation of zonal architectures by enabling basic MCUs, rather than higher-level MCUs with a MAC, to be used when creating sensors, actuators, and other devices for the edge of OT and IT networks.

ARIES Embedded and Emdalo Technologies collaborated to enhance embedded modules centered on Microchip's PolarFire SoC architecture. ARIES designed the M100PF and M100PFS system-on-modules (SoM) delivering effective embedded ecosystems for power computations in applications such as smart embedded vision, industrial automation, communications, and IoT.

RISC-V Summit, San Jose. Microchip worked with NASA and the aerospace and defense industry to develop a RISC-V-based High-Performance Spaceflight Computing (HPSC) processor that is being presented at the RISC-V Summit. Microchip is also promoting its PolarFire 2 FPGA silicon platform and RISC-V-based processor subsystem with a software suite roadmap at the Summit.

CHANDLER, Arizona— Microchip Technology’s recently announced LAN8840 and LAN8841 Gigabit Ethernet transceiver devices are a standard-based solution designed to provide critical process synchronization to developers of industrial-grade networking solutions, such as process automation applications.

CHANDLER, Ariz.,— Microchip Technology is introducing its first Arm Cortex®-M4F-based PIC microcontroller (MCU) family designed to combat wireless connectivity design challenges with the integration of Bluetooth Low Energy functionality, which can be directly integrated into a systems’ components.